Wamkelekile kuni, balandeli abathandekayo, kubonakala kutshanje
Iinkcukacha zeprosesa yeHuawei ivuza kwaye yeyona inamandla ukuza kuthi ga ngoku
Yasungulwa phantsi kwegama
(Hisilicon Kirin)
Iinkcukacha ezingakumbi malunga nale prosesa ebizwa ngokuba yiHisilicon Kirin
Ligama elisemthethweni leHuawei processors, elivelisayo kwaye lenze ngaphakathi kweefektri zenkampani yaseTaiwan iTSMC.
Inkampani yaseTshayina yayibhengeze kunyaka ophelileyo kumboniso we-IFA eBerlin malunga neprosesa ye-chip Kirin 970, eza njengeprosesa yokuqala exhasa iyunithi yobukrelekrele bokwenziwa.
UHuawei ulungiselela iprosesa entsha eza kusetyenziswa kwizixhobo zayo ezizayo, kwaye ndicinga ukuba isiqalo siya kuba nge-Mate 20 kunye ne-20 Pro ...
Iprosesa entsha ibizwa ngokuba yiKirin 980.
Iqulathe iicores ezisibhozo zoyilo lweCortex A77 kumjikelo we-2.8 GHz njengesantya esiphezulu kwi-core nganye kwezine…
Ukongeza kwezinye iicores ezine zoyilo lweCortex A55 njengeecores ezonga amandla.
Iprosesa iya kwakhiwa kusetyenziswa ubuchwepheshe be-TSMC obunini be-7Fm FineFet, kunye nokusebenzisa i-AI yamva nje evela kwi-Cambricorn, eya kwenza i-NPU ibe mpuluswa ngezibalo ezi-5 zetriliyoni ngewatt nganye.
Ngokubhekiselele kwiprosesa yegraphics, kulindeleke ukuba iveliswe yi-Hisilicon kwaye ilindeleke ukuba ibe namandla aphindwe kabini anesiqingatha kuneprosesa ye-Adreno 630 esetyenziswa ngoku kunye neprosesa ye-Qualcomm 845.
